Design & Mfg. Software
CAD/CAM Software Advancements Anticipate More Efficient Production
Hexagon Manufacturing Intelligence reveals future capabilities for its EDGECAM 2022 software, details newest enhancement for WORKNC CAD.
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Here Are Your Top 10 Most-Read Features of 2021
A list of the most-viewed features in MoldMaking Technology from January to November 2021.
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Three CAD/CAM Automation Advances
Feature-, attribute- and script-based CAD/CAM automation ease programming and skilled labor challenges.
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Verisurf Debuts 2022 Software Release
Verisurf 2022 is a measurement software for automated quality inspection and reporting, scanning, reverse engineering and tool building. The platform offers a range of new features including model-based definition to support intelligent inspection.
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CNC Additive Simulation Ensures Moldmaking Component Quality and Accuracy
CGTech’s VERICUT software features an additive module that simulates both additive and traditional milling or turning capabilities, including material deposition.
WatchXometry Launches Autodesk Fusion 360 App Version 2.0
The updated app features instant manufacturability feedback and multiple part upload capabilities along with pricing and lead time estimates.
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Upfront Decisions Matter! It’s About Making Better Decisions Sooner
This free archived webinar covers how to use simulation to reduce manufacturing risk, to optimize performance and to directly get from art to part without iterative changes.
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Creating a Digital Twin of Your Mold: Setting Up for Success
Tips for laying the groundwork for optimizing your mold design.
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3 Is the Magic Number
Canon Virginia kicks off this free webinar telling attendees that they will not be sharing something they don’t already know, but will share a few best practices for getting things right the first time—three steps to improve medical tooling and validation times.
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Molding Analysis Software Series Refines Simulation Capabilities
The latest release, Moldex3D 2021, improves accuracy, customization of simulation reports, offers more seamless integration, enhances access in advanced process and composite materials and supports IC packaging process simulation.
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