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Molding Analysis Software Series Refines Simulation Capabilities

The latest release, Moldex3D 2021, improves accuracy, customization of simulation reports, offers more seamless integration, enhances access in advanced process and composite materials and supports IC packaging process simulation. 

Grace Nehls, Former MMT Editor

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Moldex3D 2021 IC potting process simulation.

IC potting process simulation. Photo Credit: CoreTech Systems (Moldex3D)

CoreTech System Co. Ltd. (Moldex3D) has released the latest version of its molding analysis software series, Moldex3D 2021. In addition to refining simulation capabilities to provide better user experiences, more powerful analysis modules have also been incorporated into the system to meet different customer needs across industries. The important updates and highlights of Moldex3D 2021 are as follows. 

For common shrinkage and warpage prediction of injection molding, Moldex3D 2021 combines the material and stress characteristics of plastic phase changes in the packing stage, further increasing the prediction accuracy. Furthermore, mechanical property simulation is introduced to optimize the calculation accuracy of short fiber materials, enabling users to receive better results of warpage prediction of fiber-filled materials. The curve construction and editing capabilities are also enhanced to generate higher-quality mesh with greater success rate and efficiency. With the newly added Nozzle Zone Wizard as well as the upgraded Gate, Runner and Cooling Channel Wizards, the company says users are able to optimize designs with parameters and automatic mesh generation, making design validations easy and precise.

Moldex3D notes that different analysis reports are required based on mold characteristics. Users can use Studio 2021 to customize their report format and choose which items to display.

Another feature, Moldex3D iSLM, helps users manage, share and compare mold trial results and molding analysis through a simple click using a laptop or smart phone. Information can be accessed anytime, anywhere.

Moldex3D 2021 has also reportedly optimized the efficiency of submission process and parallel processing on Linux HPC. Engineers can run molding simulation efficiently on the remote Linux HPC cluster, on private or on public cloud, for more rapid analyzing and calculation of millions of elements. 

Advancing process prediction capabilities, Moldex3D’s non-matching mesh technology is said to also reduce the mesh generation time and improve the accuracy for resin transfer molding (RTM) simulation of multi-layer fiber mat draping design. The new physical foaming capabilities provide a new microscopic foaming prediction model, increasing the prediction precision of the existing modules of different foaming processes.

In addition to the above breakthroughs, Moldex3D 2021 also supports fiber-mat thermoplastic continuous fiberboard composite simulation. By setting the continuous fiber material property values, users can analyze how fiber orientation impacts product quality and mechanical strength to further optimize their product designs.

Finally, Moldex3D’s new potting simulation capabilities are now available for IC packaging users. The Pre-Processing Wizard is able to quickly generate high-quality mesh, Moldex3D says, which saves model preparation time and helps users validate IC packaging design, reducing trial and error costs significantly.

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