Yudo Features Diffusion-Bonded Process for Hot Runner Manifolds
Yudo Inc. will be showcasing its diffusion-bonding process, which facilitates more design freedom for melt flow distribution, at Amerimold 2021.
Photo Credit: Yudo Inc.
Diffusion bonding, Yudo’s solid-state diffusion welding process for hot runner manifolds, is meant to create hot runner systems in various volumetric sizes and cavity pitches with inherent advantages for melt distribution (see “How to Improve Melt Distribution with Diffusion-Bonded Manifolds”).
Diffusion bonding is usually implemented by applying high pressure, in conjunction with high temperature—approximately 50-75% of the absolute melting temperature of the materials. This causes the atoms from each material to combine with one another, resulting in a bond that is said to be stronger than weld.
The process reportedly eliminates sharp corners and dead spots within a manifold’s internal flow channels for optimized resin flow, and helps reduce color change over time. Yudo says it also uses this process for plastic injection molding components; cooling lines are placed in areas traditional machining cannot reach.
Exhibitor: Yudo Inc.
Booth 341
Related Content
-
How to Use Thermal Management to Improve Mold Cooling
A review of common mold cooling issues and possible solutions, including 3D printing applications.
-
Lights-Out Metal 3D Printer Minimizes EDM Needs for Moldmakers
The Matsuura LUMEX series boasts both forming and milling capabilities in one unit, achieving highly accurate mold component production, with the ablity to integrate conformal cooling and porous venting.
-
A 3D Printing Retrospective
A personal review of the evolution of 3D printing in moldmaking throughout the past 25 years.